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BBA-322-A BBA-519-A GENERAL-PURPOSE BROADBAND RF AMPLIFIER DATA GUIDE DESCRIPTION:
The BBA series is a family of low-cost high-performance broadband RF amplifiers. The modules are ideally suited to a wide range of amplification and buffering applications including extending the range of Linx's own RF modules (when legally appropriate). Housed in a compact SMD package, the hybrid amps are prematched to 50 source and load impedances and require no external RF components. The modules utilize a GaHBT gain stage which yields high gain and IP3, excellent flatness and low noise.
PHYSICAL DIMENSIONS
ALL BBA AMPS FEATURE:
s s s s Prematched for 50 Impedance I/O No External RF Components Required Exceptional Gain Flatness Compact Surface-Mount Package (for easy hand or automated mounting)
RF OUT GND GND GND
GND VCC GND RF IN
PINOUTS (BOTTOM VIEW)
BBA-322 FEATURES:
s s s s s s High Gain Model 10 Mhz-3 Ghz Broadband Operation +20dB Small Signal Gain @ 900MHz Up to +10 (10mW) Linear Output Power 3.8 dB Noise Figure Operates From a Single Supply
APPLICATIONS INCLUDE:
s s s s TX/RX Range Enhancement* IF or RF Buffering Driver or Final Stage for PA General-Purpose Gain Blocks
BBA- 519 FEATURES:
s s s s s s High Output Model 10 Mhz-4 Ghz Broadband Operation +18dB Small Signal Gain @ 900MHz Up to +17 (50mW) Linear Output Power 4.8 dB Noise Figure Operates From a Single Supply
ORDERING INFORMATION
PART #
BBA-322-A BBA-519-A
DESCRIPTION
Hi-Gain RF Amp Hi-Power RF Amp
BBA Amplifiers are supplied in tube packaging - 50 pcs. per tube.
Revised 1/26/01
PERFORMANCE DATA - BBA-519-A
Parameters BBA-519-A Supply Current Input RF Power Environmental Operating Temp. Storage Temp. Rating 120 +13 -40 to +85 -60 to 150 Unit mA dBm C C
ABSOLUTE MAXIMUM RATINGS
These ratings are intended to indicate the limits past which device damage may occur. Operation of the device at these limits is not suggested or guaranteed.
HANDLING CAUTION
ESD Sensitive Device
TYPICAL OPERATING PARAMETERS
All parameters measured @ 5.2 Volts, 25C, -30dBm input
Parameters BBA-519-A Frequency Range Gain
Gain Flatness Noise Figure Input VSWR Output VSWR Output IP3 Output P1dB Reverse Isolation Power Supply Device Operating Voltage
Typical 10 to 4000 18 17 15 13 12 2 4.8 2.1:1 1.8:1 +33 +18.5 20 4.8-5.2 5.2-12 60
Units MHz dB dB dB dB dB dB dB
dBm dBm dB VDC VDC mA
Notes T=25C, Icc=65mA Freq=100MHz Freq=1000MHz Freq=2000MHz Freq=3000MHz Freq=4000MHz 100MHz to 2000MHz Freq=2000MHz In a 50system, DC to 4000MHz In a 50system, DC to 4000MHz Freq=1000MHz50KHz, PTONE=-10dBm Freq=1000MHz Freq=2000MHz
VCC regulated between 4.8 and 5.2VDC VCC Range using appropriate current limiting resistor inline with VCC
Operating Current Environmental Rated Operating Temperature
@5VDC
0-70
C
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PERFORMANCE DATA - BBA-322-A
Parameters Supply Current Input RF Power Environmental Operating Temp. Storage Temp. Rating 65 +15 -40 to +85 -60 to 150 Unit mA dBm C C
ABSOLUTE MAXIMUM RATINGS
These ratings are intended to indicate the limits past which device damage may occur. Operation of the device at these limits is not suggested or guaranteed.
HANDLING CAUTION
ESD Sensitive Device
TYPICAL OPERATING PARAMETERS
All parameters measured @ 5 Volts, 25C, -50dBm input
Parameters BBA-322-A Frequency Range Gain
Gain Flatness Noise Figure Input VSWR Output VSWR Output IP3 Output P1dB Reverse Isolation Power Supply Device Operating Voltage
Typical DC to 3000 21 20 17 14 2 3.8 2.3:1 2.1:1 +22.5 +11.2 20
Units MHz dB dB dB dB dB dB
dBm dBm dB
Notes T=25C, Icc=35mA Freq=100MHz Freq=1000MHz Freq=2000MHz Freq=3000MHz 100MHz to 2000MHz Freq=2000MHz In a 50system, DC to 3000MHz In a 50system, DC to 3000MHz Freq=2000MHz50KHz, PTONE=-18dBm Freq=2000MHz Freq=2000MHz
4.8-5.2 5.2-12 35
VDC VDC mA
VCC regulated between 4.8 and 5.2VDC VCC Range using appropriate current limiting resistor inline with VCC
Operating Current Environmental Rated Operating Temperature
@ 5VDC
0-70
C
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PIN DESCRIPTIONS:
Pin 1,3,5,6,7 GROUND Pin 2 VCC Ground Connection. Keep traces short and connect immediately to ground plane for best results. VCC Positive Supply Voltage. Read the Power Supply Considerations section of this manual carefully to avoid permanent device damage RF input pin. This pin is internally DC blocked. RF output. This pin is internally DC blocked.
Pin 4 Pin 8
RF IN RF OUT
GND VCC GND RF IN
RF OUT GND GND GND
*IMPORTANT NOTE:
The purchaser of this device should be aware that approvals may be required by applicable governing bodies for systems producing RF energy. It is the responsibility of the user to determine and adhere to the appropriate regulations for the region in which operation is intended.
OPERATIONAL CONSIDERATIONS
The use of a gain stage can produce a significant increase in the range performance of an RF link. It is important to note that it can also introduce detrimental effects such as the following: * Amplification of harmonics and LO along with the fundamental carrier frequency. * Adverse effect on front-end noise figure on RX's. * Potential damage if receiver input is not capable of accommodating high input power levels. * Risk of generating illegal power levels and unacceptable interference.
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POWER SUPPLY CONSIDERATIONS
The user should insure a clean source of power for the amplifier module. In cases where the supply contains excessive noise, a filter and bypass should be placed on the supply line in close proximity to the module. The power supply must be regulated to within the primary range specified or the maximum current limited using an appropriate resistance in series with the amplifier's positive supply pin. Failure to observe the supply limits will irreparibly damage the device. The resistor should be selected so that the device current is limited to or less than the maximum rated current. The resistor value may be easily selected using the following formula:
VSUPPLY - VDEVICE TYP. R= ICC 9-5 R= 60x10-3 = 4/.06 = 66
Example: BBA-519 @ 9 Volt Supply
PAD LAYOUT
The pad layout shown below is designed to facilitate both hand and automated assembly.
0.100"
BBA Pad Layout Pattern
(Not to Scale)
0.310" 0.100" 0.070"
BOARD LAYOUT
If you are at all familiar with RF devices you may be concerned about specialized layout requirements. Hi-gain high-frequency amplifiers are notorious for layout challenges. Thankfully, the BBA series is inherently very stable. By adhering to a few simple design and layout rules you will enjoy a trouble-free implementation. The module should be placed as close as possible to the transmitter or receiver with which it is to be paired. A ground plane should be placed under the module, usually on the backside of the PCB. RF traces to and from the amp should be kept short and of the proper width to assure service as a 50 transmission line. The module's RF ports are AC-coupled and require no matching in a 50 system.
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TYPICAL APPLICATION:
The schematic below pictures a typical configuration for amplifying the output of a low-cost narrowband transmitter. This configuration would result in a 6-7X increase in system range. Note that such output levels may render the transmitter illegal for operation in certain countries.
ANT1 ANTENNA VCC LINX LC SERIES TX 1 DATA IN 2 3 4 GND DATA IN GND IADJ/GND GND VCC GND RF OUT 8 7 6 5 1 2 3 4 LINX BBA-519 GND VCC GND RF IN RF OUT GND GND GND 8 7 6 5
GND
GND
GND
GND
Typical Configuration
PRODUCTION GUIDELINES
The BBA modules are packaged in a hybrid SMD package which has been designed to support hand- or automated-assembly techniques. Since BBA devices contain discrete components internally, the assembly procedures are critical to insuring the reliable function of the BBA product. The following procedures should be reviewed with and practiced by all assembly personnel.
HAND ASSEMBLY
The BBA's primary mounting surface is eight pads located on the bottom of the module. Since these pads are inaccessible Soldering Iron during mounting, castellations that run up Tip the side of the module have been provided to facilitate solder wicking to the module's underside. If the recommended pad placement has been followed, the pad on Solder the board will extend slightly past the edge of the module. Touch both the PCB pad and PCB Pads Castellations the module castellation with a fine soldering tip. Tack one module corner first, BBA Soldering Technique then work around the remaining attachment points, using care not to exceed the solder times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225C for 10 Sec. Hand-Solder Temp. RX +225C for 10 Sec. Recommended Solder Melting Point +180C Reflow Oven: +220 Max. (See adjoining diagram)
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AUTOMATED ASSEMBLY
For high-volume assembly most users will want to auto-place the modules. The modules have been designed to maintain compatibility with most pick-and-place equipment; however, due to the module's hybrid nature, certain aspects of the automated-assembly process are far more critical than for other component types. Following are brief discussions of the three primary areas where caution must be observed. Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow process. The reflow profile below should be closely followed since excessive temperatures or transport times during reflow will irreparably damage the modules. Assembly personnel will need to pay careful attention to the oven's profile to insure that it meets the requirements necessary to successfully reflow all components while still meeting the limits mandated by the modules themselves.
300 C 250 200
Temperature
Ideal Curve Limit Curve
Forced Air Reflow Profile The stated temperatures refer to the component mounting pads. 220C 210C 180C
150
125C
Reflow Zone Soak Zone 2 Minutes Max. 20-40 Sec.
100 50
Ramp-up 1-1.5 Minutes
Preheat Zone 2-2.3 Minutes
Cooling
0 0 30 60 90 120 150 180 210 240 270 300 330 360
Time (Seconds)
Required reflow profile Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled, it is imperative that the module not be subjected to shock or vibration during the time solder is liquidus. Washability The modules are wash-resistant, but are not hermetically sealed. They may be subject to a standard wash cycle; however, a twenty-four-hour drying time should be allowed before applying electrical power to the modules. This will allow any moisture that has migrated into the module to evaporate, thus eliminating the potential for shorting during power-up or testing.
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U.S. CORPORATE HEADQUARTERS:
Linx Technologies, Inc.
575 S.E. ASHLEY PLACE Grants Pass, Or 97526
PHONE: (541) 471-6256 FAX: (541) 471-6251
http://www.linxtechnologies.com
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products; for this reason, we reserve the right to make changes without notice. The information contained in this Data Sheet is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot to lot and are not guaranteed. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in a specific application. None of these devices is intended for use in applications of a critical nature where the safety of life or property is at risk. The user assumes full liability for the use of product in such applications. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Some devices described in this publication are patented. Under no circumstances shall any user be conveyed any license or right to the use or ownership of these patents.
(c) 2000 by Linx Technologies, Inc. The stylized Linx logo, Linx, and "Wireless Made Simple" are the trademarks of Linx Technologies, Inc. Printed in U.S.A. Page 8

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